Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9486879 | Bonding material and bonding body, and bonding method | Keiichi Endoh, Yu Saito, Yutaka Hisaeda, Toshihiko Ueyama | 2016-11-08 |
| 9273235 | Bonding material comprising coated silver nanoparticles and bonded object produced using same | Takashi Hinotsu, Shinya Sasaki | 2016-03-01 |