Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9486879 | Bonding material and bonding body, and bonding method | Satoru Kurita, Keiichi Endoh, Yu Saito, Toshihiko Ueyama | 2016-11-08 |
| 9240256 | Bonding material and bonding method using the same | Keiichi Endoh, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama | 2016-01-19 |