TU

Toshihiko Ueyama

DC Dowa Electronics Materials Co.: 3 patents #2 of 44Top 5%
Overall (2016): #51,867 of 481,213Top 15%
3
Patents 2016

Issued Patents 2016

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9486879 Bonding material and bonding body, and bonding method Satoru Kurita, Keiichi Endoh, Yu Saito, Yutaka Hisaeda 2016-11-08
9311947 Metal magnetic powder and process for producing the same, magnetic coating material, and magnetic recording medium Hirohisa Omoto, Takayuki Kikuchi 2016-04-12
9240256 Bonding material and bonding method using the same Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara 2016-01-19