Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406587 | Substrate conductor structure and method | Mihir K. Roy, Mathew J. Manusharow, Mark S. Hlad | 2016-08-02 |
| 9275975 | Electronic package and method of connecting a first die to a second die to form an electronic package | Mathew J. Manusharow, Mihir K. Roy | 2016-03-01 |