Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281259 | Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP | Yaojian Lin, Kang Chen, Jose Alvin Caparas | 2016-03-08 |