Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9476927 | Structure and method to determine through silicon via build integrity | Troy L. Graves-Abe, Chandrasekharan Kothandaraman | 2016-10-25 |
| 9443776 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Hazara S. Rathore +2 more | 2016-09-13 |
| 9431354 | Activating reactions in integrated circuits through electrical discharge | Cyril Cabral, Jr., Gregory M. Fritz, Kenneth P. Rodbell | 2016-08-30 |
| 9349691 | Semiconductor device with reduced via resistance | Chih-Chao Yang | 2016-05-24 |
| 9287186 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Hazara S. Rathore +2 more | 2016-03-15 |