Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520371 | Planar passivation for pads | Benfu Lin, Wanbing Yi, Wei Lu, Juan Boon Tan | 2016-12-13 |
| 9511470 | CMP head structure with retaining ring | Benfu Lin, Lei Wang, Xuesong Rao, Wei Lu | 2016-12-06 |
| 9511474 | CMP head structure with retaining ring | Benfu Lin, Wei Lu | 2016-12-06 |
| 9437547 | Through silicon vias | Benfu Lin, Hong-Chi Yu, Lup San Leong, Wei Lu | 2016-09-06 |
| 9287197 | Through silicon vias | Benfu Lin, Hong-Chi Yu, Lup San Leong, Wei Lu | 2016-03-15 |