Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2016-07-19 |
| 9312237 | Integrated circuit package with spatially varied solder resist opening dimension | Tieyu Zheng, Sumit Kumar, Sridhar Nara, Renee D. Garcia, Manohar S. Konchady +3 more | 2016-04-12 |