Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312237 | Integrated circuit package with spatially varied solder resist opening dimension | Tieyu Zheng, Sumit Kumar, Renee D. Garcia, Manohar S. Konchady, Suresh Yeruva +3 more | 2016-04-12 |