Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385085 | Interconnects with fully clad lines | Hui Jae Yoo, Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver | 2016-07-05 |
| 9324652 | Method of creating a maskless air gap in back end interconnections with double self-aligned vias | Hui Jae Yoo, Yan Borodovsky, Florian Gstrein, David Shykind, Kevin Lin | 2016-04-26 |