Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9385085 | Interconnects with fully clad lines | Hui Jae Yoo, Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver | 2016-07-05 | $9,080,000 |
| 9324652 | Method of creating a maskless air gap in back end interconnections with double self-aligned vias | Hui Jae Yoo, Yan Borodovsky, Florian Gstrein, David Shykind, Kevin Lin | 2016-04-26 | $9,347,000 |