Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391019 | Scalable interconnect structures with selective via posts | Mauro J. Kobrinsky, Tatyana N. Andryushchenko, Ramanan V. Chebiam | 2016-07-12 |
| 9385085 | Interconnects with fully clad lines | Manish Chandhok, Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver | 2016-07-05 |
| 9349636 | Interconnect wires including relatively low resistivity cores | Tejaswi K. Indukuri, Ramanan V. Chebiam, James S. Clarke | 2016-05-24 |
| 9330963 | Conformal low temperature hermetic dielectric diffusion barriers | Sean King, Sreenivas Kosaraju, Timothy E. Glassman | 2016-05-03 |
| 9324652 | Method of creating a maskless air gap in back end interconnections with double self-aligned vias | Manish Chandhok, Yan Borodovsky, Florian Gstrein, David Shykind, Kevin Lin | 2016-04-26 |