Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9391019 | Scalable interconnect structures with selective via posts | Mauro J. Kobrinsky, Tatyana N. Andryushchenko, Hui Jae Yoo | 2016-07-12 | $10,128,000 |
| 9385085 | Interconnects with fully clad lines | Manish Chandhok, Hui Jae Yoo, Christopher J. Jezewski, Colin T. Carver | 2016-07-05 | $9,080,000 |
| 9349636 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke | 2016-05-24 | $13,693,000 |