Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508690 | Semiconductor TSV device package for circuit board connection | David J. West | 2016-11-29 |
| 9496234 | Wafer-level chip-scale package structure utilizing conductive polymer | Kibby B. Horsford, Sudeep Mandal | 2016-11-15 |
| 9484239 | Sacrificial carrier dicing of semiconductor wafers | Douglas O. Powell, David J. Russell, David J. West | 2016-11-01 |
| 9478453 | Sacrificial carrier dicing of semiconductor wafers | Douglas O. Powell, David J. Russell, David J. West | 2016-10-25 |
| 9472483 | Integrated circuit cooling apparatus | Jeffrey P. Gambino, Sudeep Mandal, Sebastian T. Ventrone | 2016-10-18 |
| 9433105 | Method of fabricating printed circuit boards | Thomas E. Lombardi, Sudipta K. Ray, David J. West | 2016-08-30 |
| 9368425 | Embedded heat spreader with electrical properties | Jay F. Leonard, David J. West, Charles H. Wilson | 2016-06-14 |
| 9356089 | Low temperature fabrication of lateral thin film varistor | Jeffrey P. Gambino, Sudeep Mandal | 2016-05-31 |
| 9299590 | Integrated micro-peltier cooling components in silicon-on-insulator (SOI) layers | Ezra D. B. Hall, Vibhor Jain, Jack R. Smith, Sebastian T. Ventrone | 2016-03-29 |
| 9236361 | Millimeter wave wafer level chip scale packaging (WLCSP) device | Hanyi Ding, Gary R. Hill, Wayne H. Woods, Jr. | 2016-01-12 |