Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496234 | Wafer-level chip-scale package structure utilizing conductive polymer | Richard S. Graf, Sudeep Mandal | 2016-11-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496234 | Wafer-level chip-scale package structure utilizing conductive polymer | Richard S. Graf, Sudeep Mandal | 2016-11-15 |