GH

Gary R. Hill

IBM: 1 patents #5,048 of 10,295Top 50%
Overall (2016): #398,498 of 481,213Top 85%
1
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9236361 Millimeter wave wafer level chip scale packaging (WLCSP) device Hanyi Ding, Richard S. Graf, Wayne H. Woods, Jr. 2016-01-12