Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9372208 | Signal monitoring of through-wafer vias using a multi-layer inductor | Kirk D. Peterson, Norman W. Robson, Keith C. Stevens | 2016-06-21 |
| 9269642 | Methods for testing integrated circuits of wafer and testing structures for integrated circuits | Michael T. Coster, Jeffrey P. Gambino, Kirk D. Peterson | 2016-02-23 |