Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484252 | Integrated circuits including selectively deposited metal capping layers on copper lines and methods for fabricating the same | Moosung Chae | 2016-11-01 |
| 9431294 | Methods of producing integrated circuits with an air gap | Ming He, Errol Todd Ryan, Roderick A. Augur, Craig Child | 2016-08-30 |
| 9362228 | Electro-migration enhancing method for self-forming barrier process in copper metalization | Moosung Chae | 2016-06-07 |
| 9318436 | Copper based nitride liner passivation layers for conductive copper structures | Xunyuan Zhang, Ming He, Sean Xuan Lin, John A. Iacoponi, Errol Todd Ryan | 2016-04-19 |
| 9287183 | Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch | Artur Kolics, Praveen Nalla | 2016-03-15 |
| 9236299 | Methods of forming a metal cap layer on copper-based conductive structures on an integrated circuit device | Xunyuan Zhang, Hoon Kim, Christian Witt | 2016-01-12 |