Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490211 | Copper interconnect | Lie Zhao | 2016-11-08 |
| 9476018 | Wafer cleaning formulation | — | 2016-10-25 |
| 9406556 | Method of making an interconnect device | — | 2016-08-02 |
| 9382627 | Methods and materials for anchoring gapfill metals | — | 2016-07-05 |
| 9368340 | Metallization of the wafer edge for optimized electroplating performance on resistive substrates | — | 2016-06-14 |
| 9353444 | Two-step deposition with improved selectivity | Praveen Nalla, Seshasayee Varadarajan | 2016-05-31 |
| 9287183 | Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch | Larry Zhao, Praveen Nalla | 2016-03-15 |