| 9530689 |
Methods for fabricating integrated circuits using multi-patterning processes |
Deniz E. Civay, Jiong Li, Guillaume Bouche, Richard A. Farrell |
2016-12-27 |
| 9502528 |
Borderless contact formation through metal-recess dual cap integration |
Guillaume Bouche, Tuhin Guha Neogi, Mark A. Zaleski, Andy Wei |
2016-11-22 |
| 9472455 |
Methods of cross-coupling line segments on a wafer |
Lei Yuan, Lixia Lei, David Pritchard, Tuhin Guha Neogi |
2016-10-18 |
| 9465907 |
Multi-polygon constraint decomposition techniques for use in double patterning applications |
Ahmed Hassan, Nader Magdy Hindawy, Vikrant Chauhan, David Pritchard, Abbas Guvenilir +2 more |
2016-10-11 |
| 9461128 |
Method for creating self-aligned transistor contacts |
Mark A. Zaleski, Andy Wei, Tuhin Guha Neogi, Guillaume Bouche |
2016-10-04 |
| 9436081 |
Methods of modifying masking reticles to remove forbidden pitch regions thereof |
David Pritchard |
2016-09-06 |
| 9412655 |
Forming merged lines in a metallization layer by replacing sacrificial lines with conductive lines |
Guillaume Bouche, Vikrant Chauhan, Andy Wei |
2016-08-09 |
| 9236437 |
Method for creating self-aligned transistor contacts |
Mark A. Zaleski, Andy Wei, Tuhin Guha Neogi, Guillaume Bouche |
2016-01-12 |
