Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461012 | Copper ball bond features and structure | Leo M. Higgins, III | 2016-10-04 |
| 9437459 | Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure | Burton J. Carpenter, Tu-Anh N. Tran | 2016-09-06 |
| 9437574 | Electronic component package and method for forming same | Tu-Anh N. Tran | 2016-09-06 |
| 9368470 | Coated bonding wire and methods for bonding using same | Burton J. Carpenter, Tu-Anh N. Tran | 2016-06-14 |
| 9331050 | Localized alloying for improved bond reliability | Kevin J. Hess | 2016-05-03 |
| 9331046 | Integrated circuit package with voltage distributor | Kian Leong Chin, Kevin J. Hess, James P. Johnston, Tu-Anh N. Tran, Heng Keong Yip | 2016-05-03 |
| 9324675 | Structures for reducing corrosion in wire bonds | Burton J. Carpenter, Tu-Anh N. Tran | 2016-04-26 |
| 9257403 | Copper ball bond interface structure and formation | Tu-Anh N. Tran, John G. Arthur, Yin Kheng Au, Chin Teck Siong, Meijiang Song +2 more | 2016-02-09 |