Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257403 | Copper ball bond interface structure and formation | Tu-Anh N. Tran, Yin Kheng Au, Chu-Chung Lee, Chin Teck Siong, Meijiang Song +2 more | 2016-02-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257403 | Copper ball bond interface structure and formation | Tu-Anh N. Tran, Yin Kheng Au, Chu-Chung Lee, Chin Teck Siong, Meijiang Song +2 more | 2016-02-09 |