Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287236 | Flexible packaged integrated circuit | Teck Beng Lau, Chee Seng Foong | 2016-03-15 |
| 9257403 | Copper ball bond interface structure and formation | Tu-Anh N. Tran, John G. Arthur, Yin Kheng Au, Chu-Chung Lee, Meijiang Song +2 more | 2016-02-09 |