Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437459 | Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure | Chu-Chung Lee, Tu-Anh N. Tran | 2016-09-06 |
| 9368470 | Coated bonding wire and methods for bonding using same | Chu-Chung Lee, Tu-Anh N. Tran | 2016-06-14 |
| 9324675 | Structures for reducing corrosion in wire bonds | Chu-Chung Lee, Tu-Anh N. Tran | 2016-04-26 |