Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391045 | Recessed semiconductor substrates and associated techniques | Albert Wu, Roawen Chen, Chung Chyung Han, Shiann-Ming Liou, Runzi Chang +2 more | 2016-07-12 |
| 9275929 | Package assembly having a semiconductor substrate | Shiann-Ming Liou, Sehat Sutardja, Albert Wu, Chuan-Cheng Cheng | 2016-03-01 |
| 9257410 | Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate | Albert Wu, Roawen Chen, Chung Chyung Han, Shiann-Ming Liou, Runzi Chang +2 more | 2016-02-09 |
| 9245961 | Reducing source contact to gate spacing to decrease transistor pitch | Albert Wu, Pantas Sutardja, Winston Lee, Peter Wung Lee, Runzi Chang | 2016-01-26 |