Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048326 | Method and apparatus for determining an etch property using an endpoint signal | Hongyu Yue | 2011-11-01 |
| 7914657 | Controlling the thickness of wafers during the electroplating process | Wai B. Fu, Shahram Y. Mehdizadeh, Yeak-Chong Wong | 2011-03-29 |