WF

Wai B. Fu

HG HGST: 1 patents #217 of 516Top 45%
📍 Menlo Park, CA: #224 of 546 inventorsTop 45%
🗺 California: #14,783 of 41,698 inventorsTop 40%
Overall (2011): #134,481 of 364,097Top 40%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7914657 Controlling the thickness of wafers during the electroplating process Hieu Lam, Shahram Y. Mehdizadeh, Yeak-Chong Wong 2011-03-29