Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7914657 | Controlling the thickness of wafers during the electroplating process | Wai B. Fu, Hieu Lam, Shahram Y. Mehdizadeh | 2011-03-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7914657 | Controlling the thickness of wafers during the electroplating process | Wai B. Fu, Hieu Lam, Shahram Y. Mehdizadeh | 2011-03-29 |