Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043870 | CMP pad thickness and profile monitoring system | Antoine P. Manens, Hichem M'Saad | 2011-10-25 |
| 8012000 | Extended pad life for ECMP and barrier removal | Yuchun Wang, Robert Ewald, Liang-Yuh Chen | 2011-09-06 |
| 7993485 | Methods and apparatus for processing a substrate | Erik C. Wasinger, Gary C. Ettinger, Sen-Hou Ko, Liang-Yuh Chen, Ho Seon Shin +1 more | 2011-08-09 |