Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8012000 | Extended pad life for ECMP and barrier removal | Robert Ewald, Wei-Yung Hsu, Liang-Yuh Chen | 2011-09-06 |
| 7955519 | Composition and method for planarizing surfaces | Jason Aggio, Bin Lu, John Parker, Renjie Zhou | 2011-06-07 |