Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072770 | Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame | Sreenivasan K. Koduri | 2011-12-06 |
| 8053876 | Multi lead frame power package | Bernhard Lange, Anthony L. Coyle | 2011-11-08 |
| 7919842 | Structure and method for sealing cavity of micro-electro-mechanical device | Christopher Daniel Manack | 2011-04-05 |