Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053876 | Multi lead frame power package | Steven Kummerl, Anthony L. Coyle | 2011-11-08 |
| 8039956 | High current semiconductor device system having low resistance and inductance | Anthony L. Coyle | 2011-10-18 |
| 7863098 | Flip chip package with advanced electrical and thermal properties for high current designs | Anthony L. Coyle | 2011-01-04 |