Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053285 | Thermally enhanced single inline package (SIP) | Chris Haga, William D. Boyd | 2011-11-08 |
| 8053876 | Multi lead frame power package | Steven Kummerl, Bernhard Lange | 2011-11-08 |
| 8039956 | High current semiconductor device system having low resistance and inductance | Bernhard Lange | 2011-10-18 |
| 7863098 | Flip chip package with advanced electrical and thermal properties for high current designs | Bernhard Lange | 2011-01-04 |