WB

William D. Boyd

TI Texas Instruments: 1 patents #320 of 1,078Top 30%
📍 Agency, IA: #1 of 1 inventorsTop 100%
🗺 Iowa: #361 of 1,342 inventorsTop 30%
Overall (2011): #131,909 of 364,097Top 40%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8053285 Thermally enhanced single inline package (SIP) Chris Haga, Anthony L. Coyle 2011-11-08