Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072770 | Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame | Steven Kummerl | 2011-12-06 |
| 8017410 | Power semiconductor devices having integrated inductor | — | 2011-09-13 |
| 7910471 | Bumpless wafer scale device and board assembly | Edgar Zuniga-Ortiz | 2011-03-22 |