Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8033039 | High frequency flip chip package process of polymer substrate and structure thereof | Edward Yi Chang, Li-Han Hsu, Chee-Way Oh, Chin-Te Wang | 2011-10-11 |
| 7969193 | Differential sensing and TSV timing control scheme for 3D-IC | Yen-Huei Chen, Meng-Fan Chang | 2011-06-28 |
| 7940143 | Vertical transmission line structure that includes bump elements for flip-chip mounting | Edward Yi Chang, Ruey-Bing Hwang, Li-Han Hsu | 2011-05-10 |
| 7898081 | MEMS device and method of making the same | Bang-Chiang Lan, Li-Hsun Ho, Hui-Min Wu, Min Chen, Chien-Hsin Huang +1 more | 2011-03-01 |