Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7940143 | Vertical transmission line structure that includes bump elements for flip-chip mounting | Edward Yi Chang, Wei-Cheng Wu, Li-Han Hsu | 2011-05-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7940143 | Vertical transmission line structure that includes bump elements for flip-chip mounting | Edward Yi Chang, Wei-Cheng Wu, Li-Han Hsu | 2011-05-10 |