Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8033039 | High frequency flip chip package process of polymer substrate and structure thereof | Li-Han Hsu, Chee-Way Oh, Wei-Cheng Wu, Chin-Te Wang | 2011-10-11 |
| 8034654 | Method for forming a GexSi1-x buffer layer of solar-energy battery on a silicon wafer | Shih-Hsuan Tang, Yue-Cin Lin | 2011-10-11 |
| 7940143 | Vertical transmission line structure that includes bump elements for flip-chip mounting | Wei-Cheng Wu, Ruey-Bing Hwang, Li-Han Hsu | 2011-05-10 |