Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8033039 | High frequency flip chip package process of polymer substrate and structure thereof | Edward Yi Chang, Li-Han Hsu, Chee-Way Oh, Wei-Cheng Wu | 2011-10-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8033039 | High frequency flip chip package process of polymer substrate and structure thereof | Edward Yi Chang, Li-Han Hsu, Chee-Way Oh, Wei-Cheng Wu | 2011-10-11 |