HK

HyoungChul Kwon

SC Stats Chippac: 1 patents #96 of 188Top 55%
📍 Seoul, KR: #1,425 of 3,741 inventorsTop 40%
Overall (2011): #281,239 of 364,097Top 80%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7863761 Integrated circuit package system with molding vents Dal Jae Lee, Nam Ju Cho, Soo-San Park, Jaepil Kim, Sungpil Hur +3 more 2011-01-04