Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8022555 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Tae-Gyeong Chung | 2011-09-20 |
| 8008771 | Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device | Pyoung-Wan Kim, Jong Ho Lee, Teak-Hoon Lee, Chul-Yong Jang | 2011-08-30 |
| 7923291 | Method of fabricating electronic device having stacked chips | Hae-Jung Yu, Tae-Gyeong Chung, Nam-Seog Kim | 2011-04-12 |
| 7915710 | Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate | Jong Ho Lee, Dong-Ho Lee, Yong-Chai Kwon | 2011-03-29 |
| 7898075 | Semiconductor package having resin substrate with recess and method of fabricating the same | Chul-Yong Jang, Pyoung-Wan Kim, Taek-Hoon Lee | 2011-03-01 |
| 7888785 | Semiconductor package embedded in substrate, system including the same and associated methods | Min-Ho O, Jong Ho Lee | 2011-02-15 |