Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7898075 | Semiconductor package having resin substrate with recess and method of fabricating the same | Chul-Yong Jang, Eun-Chul Ahn, Pyoung-Wan Kim | 2011-03-01 |
TL
Taek-Hoon Lee
Overall (2011): #153,111 of 364,097Top 45%
1
Patents 2011