Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008771 | Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device | Pyoung-Wan Kim, Eun-Chul Ahn, Jong Ho Lee, Teak-Hoon Lee | 2011-08-30 |
| 7898075 | Semiconductor package having resin substrate with recess and method of fabricating the same | Eun-Chul Ahn, Pyoung-Wan Kim, Taek-Hoon Lee | 2011-03-01 |