Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053807 | Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages | Dong-Ho Lee | 2011-11-08 |
| 7939947 | Semiconductor package structure | Dong-Ho Lee | 2011-05-10 |
| 7915710 | Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate | Jong Ho Lee, Dong-Ho Lee, Eun-Chul Ahn | 2011-03-29 |
| 7884875 | Camera module having lower connection portions defining a chip region and engaging upper connection portions of a lens structure and method of fabricating the same | Dong-Ho Lee | 2011-02-08 |