Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8065797 | Fabricating method for printed circuit board | Ryoichi Watanabe, Je-Gwang Yoo, Joon-Sung Kim, Seung Chul KIM, Myung-San Kang | 2011-11-29 |
| 8061025 | Method of manufacturing heat radiation substrate having metal core | Seung Hyun CHO, Soon Jin Cho, Jin Won Choi | 2011-11-22 |
| 8022311 | Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same | Tae Eui Kim, Myung Sam Kang, Je-Gwang Yoo | 2011-09-20 |
| 7888599 | Printed circuit board including embedded capacitor and method of fabricating same | Young Woo Kim, Chang Myung Ryu, Woo Lim Chae, Han Kim | 2011-02-15 |
| 7875340 | Heat radiation substrate having metal core and method of manufacturing the same | Seung Hyun CHO, Soon Jin Cho, Jin Won Choi | 2011-01-25 |
| 7863723 | Adhesive on wire stacked semiconductor package | Kwang Seok Oh, Jong-Wook Park, Young-Kuk Park | 2011-01-04 |