Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080741 | Printed circuit board | Chin-Kwan Kim | 2011-12-20 |
| 8039762 | Printed circuit board having a buried solder bump and a circuit layer flush with an insulating layer | — | 2011-10-18 |
| 8022311 | Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same | Tae Eui Kim, Byoung-Youl Min, Je-Gwang Yoo | 2011-09-20 |
| 8022553 | Mounting substrate and manufacturing method thereof | Jin-yong Ahn, Chang-Sup Ryu, Byung-Youl Min | 2011-09-20 |
| 8003439 | Board on chip package and manufacturing method thereof | Chang-Sup Ryu, Jung-Hyun Park, Hoe-Ku Jung, Ji Eun Kim | 2011-08-23 |
| 7992291 | Method of manufacturing a circuit board | Hoe-Ku Jung, Je-Gwang Yoo, Ji Eun Kim, Jeong Woo Park, Jung-Hyun Park | 2011-08-09 |
| 7972460 | Method of manufacturing printed circuit board | Jung-Hyun Park, Jeong Woo Park, Ji Eun Kim | 2011-07-05 |
| 7937833 | Method of manufacturing circuit board | Hoe-Ku Jung, Je-Gwang Yoo, Ji Eun Kim, Jeong Woo Park, Jung-Hyun Park | 2011-05-10 |