Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003439 | Board on chip package and manufacturing method thereof | Myung Sam Kang, Chang-Sup Ryu, Jung-Hyun Park, Ji Eun Kim | 2011-08-23 |
| 7992291 | Method of manufacturing a circuit board | Je-Gwang Yoo, Myung Sam Kang, Ji Eun Kim, Jeong Woo Park, Jung-Hyun Park | 2011-08-09 |
| 7937833 | Method of manufacturing circuit board | Je-Gwang Yoo, Myung Sam Kang, Ji Eun Kim, Jeong Woo Park, Jung-Hyun Park | 2011-05-10 |