Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8074352 | Method of manufacturing printed circuit board | Dong-Jin Park, Seung Hyun Jung, Seung Chul KIM | 2011-12-13 |
| 8061025 | Method of manufacturing heat radiation substrate having metal core | Seung Hyun CHO, Byoung-Youl Min, Jin Won Choi | 2011-11-22 |
| 7981728 | Coreless substrate | — | 2011-07-19 |
| 7875340 | Heat radiation substrate having metal core and method of manufacturing the same | Seung Hyun CHO, Byoung-Youl Min, Jin Won Choi | 2011-01-25 |