Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8061025 | Method of manufacturing heat radiation substrate having metal core | Seung Hyun CHO, Byoung-Youl Min, Soon Jin Cho | 2011-11-22 |
| 8039761 | Printed circuit board with solder bump on solder pad and flow preventing dam | Seung Wan Kim | 2011-10-18 |
| 7952826 | Method operating hard disk drive on the basis of predicted defect using hierarchical clustering and curve fit | Hristov Stoev Youlian, Nam-guk Kim | 2011-05-31 |
| 7893355 | Lead pin for package boards | Hueng Jae Oh | 2011-02-22 |
| 7875340 | Heat radiation substrate having metal core and method of manufacturing the same | Seung Hyun CHO, Byoung-Youl Min, Soon Jin Cho | 2011-01-25 |