Issued Patents 2011
Showing 51–59 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7902067 | Post passivation interconnection schemes on top of the IC chips | Jin-Yuan Lee | 2011-03-08 |
| 7898058 | Integrated chip package structure using organic substrate and method of manufacturing the same | Jin-Yuan Lee, Ching-Cheng Huang | 2011-03-01 |
| 7892965 | Post passivation interconnection schemes on top of IC chip | Jin-Yuan Lee | 2011-02-22 |
| 7884479 | Top layers of metal for high performance IC's | — | 2011-02-08 |
| 7880304 | Post passivation interconnection schemes on top of the IC chips | Chiu-Ming Chou, Chien-Kang Chou | 2011-02-01 |
| 7868463 | High performance sub-system design and assembly | — | 2011-01-11 |
| 7868454 | High performance sub-system design and assembly | — | 2011-01-11 |
| 7863739 | Low fabrication cost, fine pitch and high reliability solder bump | Jin-Yuan Lee, Ching-Cheng Huang | 2011-01-04 |
| 7863654 | Top layers of metal for high performance IC's | — | 2011-01-04 |