Issued Patents 2011
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072070 | Low fabrication cost, fine pitch and high reliability solder bump | Jin-Yuan Lee, Mou-Shiung Lin | 2011-12-06 |
| 8008776 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-08-30 |
| 7977763 | Chip package with die and substrate | Mou-Shiung Lin, Jin-Yuan Lee | 2011-07-12 |
| 7932603 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-04-26 |
| 7919867 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-04-05 |
| 7915734 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-03-29 |
| 7915157 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-03-29 |
| 7906849 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-03-15 |
| 7906422 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-03-15 |
| 7898058 | Integrated chip package structure using organic substrate and method of manufacturing the same | Mou-Shiung Lin, Jin-Yuan Lee | 2011-03-01 |
| 7863739 | Low fabrication cost, fine pitch and high reliability solder bump | Jin-Yuan Lee, Mou-Shiung Lin | 2011-01-04 |